LOptimal for minimizing solder and flux splash Solder feeding equipment with V-grooving function for superior cost performance

Minimize solder and flux splash

As shown below, when solder is cut with a V-groove it enables the release of gas pressure generated by the flux, thereby suppressing splash. However, because the V-groove exposes the flux to outside air the solder cannot be stored for a long period of time.
When using solder with the HAKKO 375, you can groove the solder that you require.

Advantages of V-grooved solder

- Examination of solder/flux splash

Test criteria

*The effect of solder and flux splashing prevention may differ under different operation conditions.

- Measurement graph of flux splash amount

ø0.3mm

ø1.0mm

Applicable solder dia.

ø0.3, ø0.5, ø0.6, ø0.8, ø1.0（mm）

Compact design

Usage / Applications

Can be applicable with the conventional solder reel stand.

(Can be applicable with the HAKKO 611)
-Application Examples

Use an option switch to increase efficiency

Control the amount of solder that is fed using the ON/OFF switch. Use an option switch or hand switch to increase functionality even more.